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Si6926ADQ
Vishay Siliconix
SPECIFICATIONS T J = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ. a
Max.
Unit
Static
Gate Threshold Voltage
V GS(th)
V DS = V GS , I D = 250 μA
0.40
1.0
V
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current b
I GSS
I DSS
I D(on)
V DS = 0 V, V GS = ± 8 V
V DS = 20 V, V GS = 0 V
V DS = 20 V, V GS = 0 V, T J = 55 °C
V DS ≥ 5 V, V GS = 5 V
V GS = 4.5 V, I D = 4.5 A
10
0.024
± 100
1
5
0.030
nA
μA
A
Drain-Source On-State Resistance b
R DS(on)
V GS = 3.0 V, I D = 4.2 A
V GS = 2.5 V, I D = 3.9 A
0.026
0.029
0.033
0.035
Ω
V GS = 1.8 V, I D = 3.6 A
0.035
0.043
Forward Transconductance
b
g fs
V DS = 10 V, I D = 4.5 A
26
S
Diode Forward
Voltage b
V SD
I S = 0.83 A, V GS = 0 V
0.6
1.1
V
Dynamic a
Total Gate Charge
Q g
7.5
10.5
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Q gs
Q gd
R g
t d(on)
t r
V DS = 10 V, V GS = 4.5 V, I D = 4.5 A
V DD = 10 V, R L = 10 Ω
1.2
1.2
1.9
6
16
12
25
nC
Ω
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
t d(off)
t f
t rr
I D ? 1 A, V GEN = 10 V, R g = 6 Ω
I F = 0.83 A, dI/dt = 100 A/μs
46
9
20
70
15
40
ns
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
16
V GS = 5 thru 2 V
20
16
12
8
4
0
1.5 V
12
8
4
0
T C = 125 °C
25 °C
- 55 °C
0
1
2
3
4
5
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
www.vishay.com
2
V DS - Drain-to-Source Voltage (V)
Output Characteristics
V GS - Gate-to-Source Voltage (V)
Transfer Characteristics
Document Number: 72754
S-81056-Rev. B, 12-May-08
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